Multilayer ceramic capacitor and method of manufacturing the same

ABSTRACT

A multilayer ceramic capacitor includes a ceramic body including a dielectric layer and having first and second surfaces opposing each other in a width direction, third and fourth surfaces connecting the first and second surfaces in a length direction, and fifth and sixth surfaces opposing each other in a thickness direction, internal electrodes disposed inside the ceramic body, exposed through the first and second surfaces, and having one end portion exposed through the third or fourth surface, and first and second side margin portions disposed on edges of the internal electrodes, exposed through the first and second surfaces. In a cross-section cut along a width-thickness plane of the ceramic body, an area of an oxide region disposed on the edges of the internal electrodes is less than 10% of an overall area of the internal electrodes exposed through the first and second surfaces.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation application of U.S. patentapplication Ser. No. 16/186,111, filed on Nov. 9, 2018, which claimsbenefit of priority to Korean Patent Application No. 10-2018-0093708filed on Aug. 10, 2018 in the Korean Intellectual Property Office, thedisclosures of which are incorporated herein by reference in theirentireties.

TECHNICAL FIELD

The present disclosure relates to a multilayer ceramic capacitor and amethod of manufacturing the same, for adjusting an oxide region disposedon an end portion of an internal electrode to enhance reliability.

BACKGROUND

In general, an electronic component using a ceramic material, forexample, a capacitor, an inductor, a piezoelectric element, a varistor,or a thermistor, includes a ceramic body formed of a ceramic material,an internal electrode formed in the body, and an external electrodeinstalled on a surface of the ceramic body to be connected to theinternal electrode.

In accordance with the recent trend for miniaturized and multifunctionalelectronic products, a chip component has also been miniaturized andmultifunctionalized and, thus, there also has been a need forhigh-capacity products with a small size and high capacity as amultilayer ceramic capacitor.

To achieve miniaturization and high capacity in a multilayer ceramiccapacitor, an electrode effective area needs to be maximized (aneffective volume fraction required to embody capacity needs to beincreased).

As described above, to embody a miniaturized and high-capacitymultilayer ceramic capacitor, a method of exposing the internalelectrode in a width direction of the body to maximize an area of theinternal electrode in the width direction through a marginless designand separately attaching a side margin portion to the exposed surface ofthe electrode in the width direction, prior to sintering, after such achip is manufactured to complete a multilayer ceramic capacitor has beenapplied when the multilayer ceramic capacitor is manufactured.

However, during a procedure of forming a side margin portion in theabove method, many voids may be generated at an interface between aceramic body and a side margin portion, thereby degrading reliability.

Electric field concentration may occur due to the voids generated at aninterface between the ceramic body and the side margin portion and,thus, there may be a problem in terms of a lowered breakdown voltage(BDV).

Density in terms of external sintering is degraded due to the voids,thereby lowering waterproof reliability.

In general, an oxide layer is formed in a void generated at an interfacebetween the ceramic body and the side margin portion to enhance abreakdown voltage (BDV) and waterproof reliability, but there may be aproblem in terms of an insufficient effect.

Accordingly, there has been a need for research to prevent a breakdownvoltage (BDV) from being lowered and waterproof reliability from beingdegraded in a miniaturized and high-capacity product.

SUMMARY

An aspect of the present disclosure may provide a multilayer ceramiccapacitor and a method of manufacturing the same method, for adjustingan oxide region disposed on an end portion of an internal electrode toenhance reliability.

According to an aspect of the present disclosure, a multilayer ceramiccapacitor may include a ceramic body including a dielectric layer andhaving first and second surfaces opposing each other in a widthdirection of the ceramic body, third and fourth surfaces connecting thefirst and second surfaces in a length direction of the ceramic body, andfifth and sixth surfaces connected to the first to fourth surfaces andopposing each other in a thickness direction of the ceramic body,internal electrodes disposed inside the ceramic body, exposed throughthe first and second surfaces, and having one end portion exposedthrough the third or fourth surface, and first and second side marginportions disposed on edges of the internal electrode, exposed throughthe first and second surfaces. In a cross-section cut along awidth-thickness plane of the ceramic body, an area of an oxide regiondisposed on the edges of the internal electrodes is less than 10% of anoverall area of the internal electrodes exposed through the first andsecond surfaces.

According to another aspect of the present disclosure, a method ofmanufacturing a multilayer ceramic capacitor may include preparing afirst ceramic green sheet on which a plurality of first internalelectrode patterns are formed at a predetermined interval and a secondceramic green sheet on which a plurality of second internal electrodepatterns are formed at a predetermined interval, forming a ceramic greensheet stack body by stacking the first and second ceramic green sheetsin such a manner that the first and second internal electrode patternsoverlap with each other, cutting the ceramic green sheet stack body tohave a lateral surface through which edges of the first and secondinternal electrode patterns are exposed in a width direction, formingfirst and second side margin portions on the lateral surface throughwhich the edges of the first and second internal electrode patterns areexposed, and preparing a ceramic body including a dielectric layer andinternal electrodes by sintering the cut ceramic green sheet stack bodyportion. In a cross-section cut along a width-thickness plane of theceramic body, an area of an oxide region disposed on edges of theinternal electrodes may be less than 10% of an overall area of theinternal electrodes exposed through a lateral surface of the ceramicbody, and a thickness direction of the ceramic body may be a directionalong which the internal electrodes are stacked, and a width directionof the ceramic body may be a direction along which the internalelectrodes are exposed through the lateral surface.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a schematic perspective view of a multilayer ceramic capacitoraccording to an exemplary embodiment of the present disclosure;

FIG. 2 is a perspective view showing an outer appearance of the ceramicbody of FIG. 1;

FIG. 3 is a perspective view showing a ceramic green sheet stack bodybefore the ceramic body of FIG. 2 is sintered;

FIG. 4 is a lateral view viewed in a direction A of FIG. 2;

FIGS. 5A to 5F are schematic cross-sectional views of a method ofmanufacturing a multilayer ceramic capacitor according to anotherexemplary embodiment of the present disclosure; and

FIG. 6 is a graph showing comparison of a breakdown voltage (BDV)according to Inventive Example and Comparative Example.

DETAILED DESCRIPTION

Hereinafter, exemplary embodiments of the present disclosure will now bedescribed in detail with reference to the accompanying drawings.

FIG. 1 is a schematic perspective view of a multilayer ceramic capacitoraccording to an exemplary embodiment of the present disclosure.

FIG. 2 is a perspective view showing an outer appearance of the ceramicbody of FIG. 1.

FIG. 3 is a perspective view showing a ceramic green sheet stack bodybefore the ceramic body of FIG. 2 is sintered.

FIG. 4 is a lateral view viewed in a direction A of FIG. 2.

Referring to FIGS. 1 to 4, a multilayer ceramic capacitor 100 accordingto the present exemplary embodiment may include a ceramic body 110, aplurality of internal electrodes 121 and 122 formed inside the ceramicbody 110, and external electrodes 131 and 132 formed on an externalsurface of the ceramic body 110.

The ceramic body 110 may have a first surface 1 and a second surface 2,which face each other, a third surface 3 and a fourth surface 4, whichconnect the first and second surfaces 1 and 2, and a fifth surface 5 anda sixth surface 6 which are upper and lower surfaces, respectively.

The first surface 1 and the second surface 2 may be defined as surfacesthat face each other in a width direction W of the ceramic body 110, thethird surface 3 and the fourth surface 4 may be defined as surfaces thatface each other in a length direction L of the ceramic body 110, and thefifth surface 5 and the sixth surface 6 may be defined as surfaces thatface each other in a thickness direction T of the ceramic body 110.

A shape of the ceramic body 110 is not particularly limited but may be arectangular parallelepiped shape as shown in the drawing.

One end portion of each of the plurality of internal electrodes 121 and122 formed inside the ceramic body 110 may be exposed through the thirdsurface 3 or the fourth surface 4 of the ceramic body.

The internal electrodes 121 and 122 may include a first internalelectrode 121 and a second internal electrode 122 as a pair ofelectrodes with different polarities.

One end portion of the first internal electrode 121 may be exposedthrough the third surface 3 and one end portion of the second internalelectrode 122 may be exposed through the fourth surface 4.

The other end portion of the first internal electrode 121 may be spacedapart from the third surface 3 by a predetermined interval. The otherend portion of the second internal electrode 122 may be spaced apartfrom the fourth surface 4 by a predetermined interval.

First and second external electrodes 131 and 132 may be respectivelyformed on the third surface 3 and the fourth surface 4 of the ceramicbody and may be electrically connected to the internal electrode.

According to an exemplary embodiment of the present disclosure, themultilayer ceramic capacitor 100 may include the plurality of internalelectrodes 121 and 122 that are disposed inside the ceramic body 110,are exposed through the first and second surfaces 1 and 2, and have oneend portion exposed through the third surface 3 or the fourth surface 4,and a first side margin portion 112 and a second side margin portion 113that are disposed on one edges of the plurality of internal electrodes121 and 122 exposed through the first surface 1 and the second surface2.

The plurality of internal electrodes 121 and 122 may be formed insidethe ceramic body 110, each end of the plurality of internal electrodes121 and 122 may be exposed through the first surface 1 and the secondsurface 2 that are surfaces in a width direction of the ceramic body110, and the first side margin portion 112 and the second side marginportion 113 may be disposed on the exposed end portion.

An average thickness of the first side margin portion 112 and the secondside margin portion 113 may be between 2 μm and 10 μm.

According to an exemplary embodiment of the present disclosure, theceramic body 110 may include a stack structure in which a plurality ofdielectric layers 111 is stacked, and the first side margin portion 112and the second side margin portion 113 that are disposed on oppositelateral surfaces of the stack structure.

The plurality of dielectric layers 111 may be in a sintered state andmay be integrated into each other in such a manner that a boundarybetween adjacent dielectric layers is not recognizable.

A length of the ceramic body 110 may correspond to a distance to thefourth surface 4 from the third surface 3 of the ceramic body.

A length of the dielectric layer 111 may form a distance between thethird surface 3 and the fourth surface 4 of the ceramic body.

According to an exemplary embodiment of the present disclosure a lengthof the ceramic body may be, but is not limited to, 400 to 1400 μm. Inmore detail, the length of the ceramic body may be 400 to 800 μm or 600to 1400 μm.

The internal electrodes 121 and 122 may be formed on the dielectriclayer 111 and the internal electrodes 121 and 122 may be formed by beingsintered inside the ceramic body across one dielectric layer.

Referring to FIG. 3, the first internal electrode 121 may be formed onthe dielectric layer 111. The first internal electrode 121 may not beentirely formed in a length direction of a dielectric layer. That is,one end portion of the first internal electrode 121 may be spaced apartfrom the fourth surface 4 of the ceramic body by a predeterminedinterval, and the other end portion of the first internal electrode 121may be formed up to the third surface 3 to be exposed through the thirdsurface 3.

One end portion of the first internal electrode exposed through thethird surface 3 of the ceramic body may be connected to the firstexternal electrode 131.

Oppositely from the first internal electrode, one end portion of thesecond internal electrode 122 may be spaced apart from the third surface3 by a predetermined interval and the other end of the second internalelectrode 122 may be exposed through the fourth surface 4 to beconnected to the second external electrode 132.

To embody a high-capacity multilayer ceramic capacitor, the internalelectrode may be formed by stacking 400 or more layers but is notlimited thereto.

The dielectric layer 111 may have the same width as a width of the firstinternal electrode 121. That is, the first internal electrode 121 may beentirely formed in a width direction of the dielectric layer 111.

According to an exemplary embodiment of the present disclosure, a widthof a dielectric layer and a width of an internal electrode may be, butare not limited to, 100 to 900 μm. In more detail, the width of thedielectric layer and the width of the internal electrode may be 100 to500 μm or 100 to 900 μm.

As a ceramic body is miniaturized, a thickness of a side margin portionmay affect the electrical characteristics of a multilayer ceramiccapacitor. According to an exemplary embodiment of the presentdisclosure, the thickness of the side margin portion may be formed with10 μm or less to enhance the characteristics of a miniaturizedmultilayer ceramic capacitor.

That is, the side margin portion may be formed with a thickness equal toor less than 10 μm and, thus, an area in which internal electrodesoverleap with each other to form capacity is increased, therebyembodying a high-capacity and miniaturized multilayer ceramic capacitor.

The ceramic body 110 may include an active portion that facilitatesformation of capacity of a capacitor, and upper and lower cover portionsthat are respectively formed on upper and lower portions of the activeportion as upper and lower margin portions.

The active portion may be formed by repeatedly stacking the plurality offirst and second internal electrodes 121 and 122 across the dielectriclayer 111.

The upper and lower cover portions may have the same material andconfiguration as the dielectric layer 111 except that the upper andlower cover portions do not include an internal electrode.

That is, the upper and lower cover portions may include a ceramicmaterial and, for example, may include a barium titanate (BaTiO₃)-basedceramic material.

The upper and lower cover portions may each have a thickness equal to orless than 20 μm but are not limited thereto.

According to an exemplary embodiment of the present disclosure, theinternal electrode and the dielectric layer may be simultaneously cutand formed and the internal electrode may be formed with the same widthas a width of the dielectric layer, which is described below in moredetail.

According to the present exemplary embodiment, the dielectric layer maybe formed with the same width as a width of the internal electrode and,thus, an end of the plurality of internal electrodes 121 and 122 may beexposed through first and second surfaces in a width direction of theceramic body 110.

The first side margin portion 112 and the second side margin portion 113may be formed on opposite lateral surfaces in the width direction of theceramic body 110, through which the ends of the plurality of internalelectrodes 121 and 122 are exposed.

The first side margin portion 112 and the second side margin portion 113may each have a thickness equal to or less than 10 μm. As a thickness ofeach of the first side margin portion 112 and the second side marginportion 113 is reduced, an area by which internal electrodes formed inthe ceramic body overlap with each other may be relatively increased.

The thickness of each of the first side margin portion 112 and thesecond side margin portion 113 is not particularly limited as long asshort circuits of the internal electrode exposed through the lateralsurface of the ceramic body 110 is prevented and, for example, the firstside margin portion 112 and the second side margin portion 113 may havea thickness equal to or greater than 2 μm.

When the first and second side margin portions have a thickness lessthan 2 μm, there may be a worry about degraded mechanical strength withrespect to external shocks and, when the first and second side marginportions have a thickness greater than 10 μm, an overlapping area of theplurality of internal electrodes may be reduced and it may be difficultto achieve high capacity of a multilayer ceramic capacitor.

To maximize capacity of the multilayer ceramic capacitor, a method ofthinning a dielectric layer, a method of stacking a multilayer thinneddielectric layer, a method of enhancing coverage of an internalelectrode, or the like has been considered.

In addition, a method of enhancing an overlapping area of internalelectrodes forming capacity has been considered.

To increase the overlapping area of the plurality of internalelectrodes, a region of a margin portion, on which an internal electrodeis not formed, needs to be minimized.

In particular, to increase the overlapping area of the plurality ofinternal electrodes as a multilayer ceramic capacitor is miniaturized, aregion of the margin portion needs to be minimized.

According to the present exemplary embodiment, the internal electrodemay be formed an entire width-direction area of the dielectric layer anda thickness of the side margin portion may be set to be equal to or lessthan 10 μm to increase the overlapping area of the internal electrode.

In general, as a dielectric layer is configured as a multilayer, athickness of the dielectric layer and the internal electrode may bereduced. Accordingly, the internal electrode may be frequentlyshort-circuited. When the internal electrode is formed only in a portionof the dielectric layer, a step different may be generated due to theinternal electrode to reduce an accelerated lifetime or reliability.

However, according to the present exemplary embodiment, even if athinned internal electrode and dielectric layer are formed, the internalelectrode may be formed on an entire width-direction portion of thedielectric layer and, thus, the overlapping area of the internalelectrode may be increased to increase capacity of the multilayerceramic capacitor.

The step difference due to the internal electrode may be reduced toenhance an accelerated lifetime to provide a multilayer ceramiccapacitor with excellent reliability as well as excellent capacitycharacteristics.

According to an exemplary embodiment of the present disclosure, an oxideregion 140 may be disposed on an end portion of an internal electrode,which is exposed through the first surface 1 and the second surface 2and is less than 10% of an overall area of the plurality of internalelectrodes 121 and 122, in a cross-section cut along a width-thicknessplane of the ceramic body 110.

In general, many voids are generated at an interface between a ceramicbody and a side margin portion, thereby degrading reliability.

Electric field concentration occurs due to the voids generated at aninterface between the ceramic body and the side margin portion and,thus, there is a problem in terms of a lowered breakdown voltage (BDV).

Density in terms of external sintering is degraded due to the voids,thereby lowering waterproof reliability.

To overcome the problem, there is a method of forming an oxide layer ina void formed at the interface between the ceramic body and the sidemargin portion, but there is a problem in terms of an insufficienteffect.

That is, to overcome the problem in terms of a lowered breakdown voltage(BDV) due to the void and degraded waterproof reliability, the edges ofthe internal electrode may be filled with conductive metal.

According to an exemplary embodiment of the present disclosure, theoxide region 140 may be disposed on an end portion of an internalelectrode, which is exposed through the first surface 1 and the secondsurface 2 and is less than 10% of an overall area of the plurality ofinternal electrodes 121 and 122 in a cross-section cut along awidth-thickness plane of the ceramic body 110. Thus, a breakdown voltage(BDV) may be increased and reliability may be enhanced.

That is, a ratio of the edges of the internal electrode, which isexposed through the first surface 1 and the second surface 2 and onwhich the oxide region 140 is disposed, to the overall area of theplurality of internal electrodes 121 and 122 may be adjusted to be lessthan 10% and, thus, the end portion may be filled with conductive metalwhile minimizing an oxide region disposed on the exposed edges of theinternal electrode.

As described above, a ratio of conductive metal filled in the edges ofthe plurality of internal electrodes 121 and 122, which is exposedthrough the first surface 1 and the second surface 2 of the ceramic body110, may be adjusted to exceed 90% and, thus, an effect of enhancing abreakdown voltage (BDV) and enhancing waterproof reliability may beexcellent, as compared to the conventional case in which a plurality ofvoids are generated at an interface between a ceramic body and a sidemargin portion or an oxide region disposed on an end portion of aninternal electrode occupies 10% or more of an overall area of theinternal electrode.

When the oxide region is disposed on the edges of the internalelectrode, which is exposed through the first surface 1 and secondsurface 2 and is equal to or greater than 10% of the overall area of theinternal electrode, an effect of enhancing a breakdown voltage (BDV) andenhancing waterproof reliability may be achieved, as compared to theconventional case in which a plurality of voids are generated at aninterface between a ceramic body and a side margin portion but, theeffect is not satisfactory, as compared to the case in which the oxideregion 140 is disposed on the edges of the internal electrode, formingless than 10% of the overall area of the internal electrode, like in anexemplary embodiment of the present disclosure.

To repress generation of a void at the interface between the ceramicbody and the side margin portion and generation of the oxide regionformed on the edges of the internal electrode, it may be the most idealto fill an entire edges of the internal electrode with conductive metalbut it may be very difficult to manufacture the internal electrodewithout any oxide region on the entire portion of the internalelectrode.

Accordingly, it may be the most ideal that a lower limit of a ratio ofedges of the internal electrode, on which the oxide region is disposedand which is exposed through the first surface 1 and the second surface2 of the ceramic body 110, to the overall area of the internal electrodeis 0% in a cross-section cut along a width-thickness plane of theceramic body 110. According to an exemplary embodiment of the presentdisclosure, 0% may be excluded due to a limit to a process.

The conductive metal may be the same as conductive metal included in theinternal electrode and may be, for example, nickel (Ni) but is notlimited thereto.

According to an exemplary embodiment of the present disclosure, in amethod of adjusting a ratio of the edges of the internal electrode,which is exposed through the first surface 1 and the second surface 2and on which the oxide region 140 is disposed, to the overall area ofthe plurality of internal electrodes 121 and 122, to be less than 10%, alateral-surface ceramic sheet with adhesives coated thereon istransferred to a lateral surface of the ceramic body during formation ofthe first and second side margin portions 112 and 113 to enhanceadhesive force during a sintering procedure and, thus, generation of avoid at the interface between the ceramic body and the side marginportion and generation of the oxide region formed on the exposed edgesof the internal electrode may be repressed and controlled.

This is described below in detail.

Referring to FIG. 4, the first and second side margin portions 112 and113 may be divided into first regions 112 a and 113 a adjacent to anexternal surface of the side margin portions 112 and 113 and secondregions 112 b and 113 b adjacent to the internal electrodes 121 and 122exposed through the first surface 1 and the second surface 2 of theceramic body 110, in this case, content of magnesium (Mg) included inthe second regions 112 b and 113 b may be greater than content ofmagnesium (Mg) included in the first regions 112 a and 113 a.

The first and second side margin portions 112 and 113 disposed on alateral surface of the ceramic body 110 may be divided into two regionswith different compositions and, in this case, content of magnesium (Mg)included in the second regions 112 b and 113 b may be adjusted to begreater than content of magnesium (Mg) included in the first regions 112a and 113 a, thereby enhancing a breakdown voltage (BDV) and enhancingreliability.

In detail, content of magnesium (Mg) included in the second regions 112b and 113 b of the side margin portion adjacent to the ceramic body maybe adjusted to control a length of an oxide layer of an end of theinternal electrode, which is exposed through a width-direction lateralsurface of the ceramic body, thereby enhancing a breakdown voltage (BDV)and enhancing waterproof reliability.

According to an exemplary embodiment of the present disclosure, contentof magnesium (Mg) included in the second regions 112 b and 113 b of theside margin portion adjacent to the ceramic body may be adjusted torepress generation of a void at an interface between the ceramic bodyand the side margin portion.

As described above, when generation of a void at the interface betweenthe ceramic body and the side margin portion is repressed, electricfield concentration may be alleviated due to reduction in the number ofvoids in which the most serious electric field concentration occurs and,thus, a breakdown voltage (BDV) may be increased and short failure maybe reduced.

The first and second side margin portions 112 and 113 disposed on thelateral surface of the ceramic body 110 may be divided into two regionswith different compositions and, in this case, content of magnesium (Mg)may be different for each region to enhance density of the first andsecond side margin portions 112 and 113, thereby improving waterproofcharacteristics.

In detail, content of magnesium (Mg) included in the second regions 112b and 113 b of the first and second side margin portions 112 and 113 maybe adjusted to be greater than content of magnesium (Mg) included in thefirst regions 112 a and 113 a at an outer side to enhance density of thefirst regions 112 a and 113 a of the side margin portions 112 and 113,thereby enhancing waterproof characteristics.

In particular, content of magnesium (Mg) included in the first regions112 a and 113 a of the first and second side margin portions 112 and 113adjacent to the external surface of the side margin portions 112 and 113may be lowered to enhance adhesive force between the first externalelectrode 131 and the second external electrode 132.

A method of adjusting content of magnesium (Mg) included in the secondregions 112 b and 113 b to be greater than content of magnesium (Mg)included in the first regions 112 a and 113 a may be performed bydifferently configuring a composition of a dielectric for forming aceramic body and a composition of a dielectric for forming first andsecond side margin portions during a procedure of manufacturing amultilayer ceramic capacitor.

That is, when content of magnesium (Mg) in the composition of thedielectric for forming the first and second side margin portions isincreased and content of magnesium (Mg) is adjusted via diffusion duringa sintering and plasticization procedure, differently from thecomposition of the dielectric for forming the ceramic body, the contentof magnesium (Mg) included in the second regions 112 b and 113 b may beadjusted to be greater than the content of magnesium (Mg) included inthe first regions 112 a and 113 a.

Accordingly, an electric field concentrated on edges of the internalelectrode may be alleviated and breakdown as one of main failures of amultilayer ceramic capacitor may be prevented, thereby enhancing thereliability of the multilayer ceramic capacitor.

According to an exemplary embodiment of the present disclosure, a moleratio of content of magnesium (Mg) of the second regions 112 b and 113 bto content of titanium (Ti) included in the first and second side marginportions 112 and 113 may be between 10% and 30%.

A mole ratio of content of magnesium (Mg) of the second regions 112 band 113 b to content of titanium (Ti) included in the first and secondside margin portions 112 and 113 may be adjusted to be between 10% and30% to enhance a breakdown voltage (BDV), thereby enhancing waterproofreliability.

When a mole ratio of content of magnesium (Mg) of the second regions 112b and 113 b to content of titanium (Ti) included in the first and secondside margin portions 112 and 113 is less than 10%, generation of a voidat the interface between the ceramic body and the side margin portionmay not be sufficiently repressed to lower a breakdown voltage (BDV) andto increase short failure

When a mole ratio of content of magnesium (Mg) of the second regions 112b and 113 b to content of titanium (Ti) included in the first and secondside margin portions 112 and 113 is greater than 30%, there may be aproblem in that reliability due to reduction in sinteringcharacteristics and distribution of a breakdown voltage (BDV) are notuniform.

According to an exemplary embodiment of the present disclosure, aminiaturized multilayer ceramic capacitor may be configured in such amanner that the dielectric layer 111 has a thickness equal to or lessthan 0.4 μm and the internal electrodes 121 and 122 have a thicknessequal to or less than 0.4 μm.

According to an exemplary embodiment of the present disclosure, when adielectric layer and an internal electrode of a thin film that includesthe dielectric layer 111 with a thickness equal to or less than 0.4 μmand the internal electrodes 121 and 122 with a thickness equal to orless than 0.4 μm are applied, a problem in terms of reliability due to avoid generated at an interface between the ceramic body and the sidemargin portion and an oxide region formed on the edges of the internalelectrode is a very important issue.

That is, in the case of a conventional multilayer ceramic capacitor,even if density of the oxide region formed on the edges of the internalelectrode, which is exposed through a width-direction surface of theceramic body, or a ratio of the portion of the internal electrode, onwhich the oxide region is formed, to an overall area of the internalelectrode is not adjusted, there is a serious problem in terms ofreliability.

However, according to an exemplary embodiment of the present disclosure,with regard to a product to which the dielectric layer and the internalelectrode of the thin film are applied, the oxide region may be adjustednot to be formed on the edges of the internal electrode, which isexposed through the width-direction surface of the ceramic body, toprevent reduction in BDV and reliability due to a void generated at aninterface between the ceramic body and the side margin portion anddensity of the oxide region formed on the edges of the internalelectrode, which is exposed through the width-direction surface of theceramic body.

That is, according to an exemplary embodiment of the present disclosure,a ratio of the edges of the internal electrode, on which the oxideregion 140 is exposed, to an overall area of the plurality of internalelectrodes 121 and 122 exposed through the first surface 1 and secondsurface 2 may be adjusted to be less than 10% in a cross-section cutalong a width-thickness plane of the ceramic body 110. Thus, in the caseof a thin film that includes the dielectric layer 111 and the first andsecond internal electrodes 121 and 122 with a thickness equal to or lessthan 0.4 μm, breakdown voltage (BDV) may be enhanced and waterproofreliability may also be enhanced.

However, the thin film may not refer to the case in which the dielectriclayer 111 and the first and second internal electrodes 121 and 122 havea thickness equal to or less than 0.4 μm and may be interpreted as aconcept including a dielectric layer and internal electrode with asmaller thickness than a conventional product.

The first regions 112 a and 113 a may have a width equal to or less than12 μm and the second regions 112 b and 113 b may have a width equal toor less than 3 μm but the present disclosure is not limited thereto.

Referring to FIG. 4, a ratio of a thickness tc2 of a region of the firstor second side margin portion, contacting an end of an internalelectrode disposed as the outermost portion, to a thickness tc1 of aregion of the first or second side margin portion, contacting an end ofan internal electrode disposed at a central portion of the plurality ofinternal electrodes 121 and 122, may be equal to or less than 1.0.

A lower limit of the ratio of the thickness tc2 of a region of the firstor second side margin portion, contacting an end of an internalelectrode disposed as the outermost portion, to the thickness tc1 of aregion of the first or second side margin portion, contacting an end ofan internal electrode disposed at a central portion, is not particularlylimited but may be equal to or greater than 0.9.

According to an exemplary embodiment of the present disclosure, unlikethe prior art, the first or second side margin portion is formed byattaching a ceramic green sheet to a lateral surface of a ceramic bodyand, thus, a thickness for each position of the first or second sidemargin portion may be constant.

That is, a conventionally, a side margin portion is formed by coating orprinting ceramic slurry and, thus, a deviation in the side marginportion for each position is serious.

In detail, conventionally, a thickness of a region of the first orsecond margin portion, contacting an end of an internal electrodedisposed at a central portion of a ceramic body, may be greater than athickness of the other region.

For example, conventionally, a ratio of a thickness of a region of thefirst or second margin portion, contacting an end of an internalelectrode disposed as the outermost portion, to the thickness of aregion of the first or second margin portion, contacting an end of aninternal electrode disposed at the central portion may be less than 0.9and, thus, a deviation between the thicknesses is high.

As such, in the conventional case in which a deviation in a thickness ofa side margin portion for each position is high, a multilayer ceramiccapacitor with a constant size has a large portion occupied by the sidemargin portion and, thus, it is not possible to ensure a large size of acapacity formation portion and it is difficult to ensure high capacity.

On the other hand, according to an exemplary embodiment of the presentdisclosure, an average thickness of the first and second side marginportions 112 and 113 is between 2 μm and 10 μm and a ratio of thethickness tc2 of the region of the first or second side margin portion,contacting an end of an internal electrode disposed as the outermostportion, to a thickness tc1 of a region of the first or second sidemargin portion, contacting an end of an internal electrode disposed at acentral portion of the plurality of internal electrodes 121 and 122, isbetween 0.9 and 1.0 and, thus, the side margin portion may have a smallthickness and a low thickness deviation to ensure a large size of acapacity formation portion.

According to an exemplary embodiment of the present disclosure, aceramic green sheet may be attached to a lateral surface of a ceramicbody and, thus, a thickness of the first or second side margin portionfor each position may be constant, differently from the conventionalcase.

Accordingly, it may be possible to embody a high-capacity multilayerceramic capacitor.

Referring to FIG. 4, a ratio of a thickness tc3 of a region of the firstor second side margin portion, contacting an edge of the ceramic body110, to the thickness tc1 of a region of the first or second side marginportion, contacting an end of an internal electrode disposed at acentral portion of the plurality of internal electrodes 121 and 122, maybe equal to or less than 1.0.

A lower limit of the ratio of thickness tc3 of a region of the first orsecond side margin portion, contacting the edge of the ceramic body 110,to the thickness tc1 of a region of the first or second side marginportion, contacting an end of an internal electrode disposed at acentral portion, may be equal to or greater than 0.9.

According to the above characteristics, a large size of a capacityformation portion may be ensured due to a small thickness deviation ofthe side margin portion for each region and, thus, it may be possible toembody a high-capacity multilayer ceramic capacitor.

FIGS. 5A to 5F are schematic cross-sectional views of a method ofmanufacturing a multilayer ceramic capacitor according to anotherexemplary embodiment of the present disclosure.

Another exemplary embodiment of the present disclosure may provide amethod of manufacturing a multilayer ceramic capacitor, includingpreparing a first ceramic green sheet on which a plurality of firstinternal electrode patterns are formed at a predetermined interval and asecond ceramic green sheet on which a plurality of second internalelectrode patterns are formed at a predetermined interval, forming aceramic green sheet stack body by stacking the first and second ceramicgreen sheets in such a manner that the first and second internalelectrode patterns intersect each other, cutting the ceramic green sheetstack body to have a lateral surface through which edges of the firstand second internal electrode patterns are exposed in a width direction,forming a first side margin portion and a second side margin portion onthe lateral surface through which the edges of the first and secondinternal electrode patterns are exposed, and preparing a ceramic bodyincluding a dielectric layer and first and second internal electrodes bysintering the cut ceramic green sheet stack body portion and, in thiscase, the first and second side margin portions are divided into a firstregion adjacent to an external surface of the side margin portion and asecond region adjacent to the first and second internal electrodes andcontent of magnesium (Mg) included in the second region is greater thancontent of magnesium (Mg) included in the first region.

Hereinafter, a method of manufacturing a multilayer ceramic capacitoraccording to another exemplary embodiment of the present disclosure isdescribed.

As shown in FIG. 5A, a plurality of stripe-type first internal electrodepatterns 221 may be formed on a ceramic green sheet 211 at apredetermined interval. The plurality of stripe-type first internalelectrode patterns 221 may be formed in parallel to each other.

The ceramic green sheet 211 may be formed of a ceramic paste including aceramic powder, an organic solvent, and an organic binder.

The ceramic powder may be a material with a high dielectric constant butmay be, but is not limited to, a barium titanate (BaTiO₃)-basedmaterial, a lead perovskite-based material, a strontium titanate(SrTiO₃)-based material, or the like and, for example, may be a bariumtitanate (BaTiO₃) powder. The ceramic green sheet 211 is sintered toform the dielectric layer 111 configuring the ceramic body 110.

The stripe-type first internal electrode pattern 221 may be formed of aninternal paste including conductive metal. The conductive metal may be,but is not limited to, nickel (Ni), copper (Cu), palladium (Pd), or analloy thereof.

A method of forming the stripe-type first internal electrode pattern 221on the ceramic green sheet 211 may not be particularly limited but, forexample, may be a printing method such as a screen printing method or agravia printing method.

Although not illustrated, a plurality of stripe-type second internalelectrode patterns 222 may be formed on another ceramic green sheet 211at a predetermined interval.

Hereinafter, a ceramic green sheet on which the first internal electrodepattern 221 is formed may be referred to as a first ceramic green sheetand a ceramic green sheet on which the second internal electrode pattern222 may be referred to as a second ceramic green sheet.

Then, as shown in FIG. 5B, first and second ceramic green sheets may bealternately stacked in such a manner that the stripe-type first internalelectrode pattern 221 and the stripe-type second internal electrodepattern 222 are stacked to intersect each other.

Then, the stripe-type first internal electrode pattern 221 may becomethe first internal electrode 121 and the stripe-type second internalelectrode pattern 222 may be the second internal electrode 122.

According to another exemplary embodiment of the present disclosure, thefirst and second ceramic green sheets may have a thickness td equal toor less than 0.6 μm and the first and second internal electrode patternsmay have a thickness te equal to or less than 0.5 μm.

The present disclosure relates to a miniaturized and high-capacitymultilayer ceramic capacitor including a thin film that includes adielectric layer with a thickness equal to or less than 0.4 μm and aninternal electrode with a thickness equal to or less than 0.4 μm and,thus, the first and second ceramic green sheets may have a thickness tdequal to or less than 0.6 μm and the first and second internal electrodepatterns may have a thickness te equal to or less than 0.5 μm.

FIG. 5C is a cross-sectional view of a ceramic green sheet stack body220 in which first and second ceramic green sheets are stacked accordingto an exemplary embodiment of the present disclosure. FIG. 5D is aperspective view of the ceramic green sheet stack body 220 in whichfirst and second ceramic green sheets are stacked.

Referring to FIGS. 5C and 5D, the first ceramic green sheet on which theplurality of stripe-type first internal electrode patterns 221 formed inparallel to each other are printed and the second ceramic green sheet onwhich the plurality of stripe-type second internal electrode pattern 222formed in parallel to each other are printed may be alternately stacked.

In more detail, the first and second ceramic green sheets may be stackedin such a manner that intervals between central portions of thestripe-type first internal electrode patterns 221 printed on the firstceramic green sheet and the stripe-type second internal electrodepatterns 222 printed on the second ceramic green sheet overlap with eachother.

Then, as shown in FIG. 5D, the ceramic green sheet stack body 220 may becut to intersect the plurality of stripe-type first internal electrodepatterns 221 and the plurality of stripe-type second internal electrodepatterns 222. That is, the ceramic green sheet stack body 220 may becomestack bodies 210 formed by cutting the ceramic green sheet stack body220 along cutting lines C1-C1 and C2-C2 that are perpendicular to eachother.

In more detail, the stripe-type first internal electrode pattern 221 andthe stripe-type second internal electrode pattern 222 may be cut in alength direction to be divided into a plurality of internal electrodeswith a constant width. In this case, the stacked ceramic green sheetsmay also be cut along with the internal electrode patterns. Accordingly,the dielectric layer may be formed with the same width as a width of theinternal electrode.

The ceramic green sheet stack body 220 may be cut along the cutting lineC2-C2 depending on a size of a separate ceramic body. That is, theplurality of stack bodies 210 may be formed by cutting a bar-type stackstructure along the cutting line C2-C2 with a ceramic body size beforethe first side margin portion and the second side margin portion areformed.

That is, the bar-type stack structure may be cut to cut overlappingpredetermined intervals formed between the central portions of the firstinternal electrodes and the second internal electrode along the samecutting line. Accordingly, one end portions of the first internalelectrode and the second internal electrode may be alternately exposedthrough the cut surface.

Then, the first side margin portion and the second side margin portionmay be formed on the first and second lateral surfaces of the stackbodies 210.

Then, as shown in FIG. 5E, first side margin portion 212 and second sidemargin portion (not shown) may be formed on the first and second lateralsurface of the stack body 210, respectively.

In detail, the first side margin portion 212 may be formed using amethod of disposing a lateral-surface ceramic green sheet 212 withadhesives (not shown) coated thereon on a punching elastic member 300formed of rubber.

Then, the stack body 210 may be rotated at an angle of 90 degrees insuch a manner that a first lateral surface of the stack body 210 facesthe lateral-surface ceramic green sheet 212 with the adhesives (notshown) coated thereon and, then, the stack body 210 may bepressed-adhered to the lateral-surface ceramic green sheet 212 with theadhesives (not shown) coated thereon.

When the stack body 210 is pressed and adhered to the lateral-surfaceceramic green sheet 212 with the adhesives (not shown) coated thereon totransfer the lateral-surface ceramic green sheet 212 to the stack body210, the lateral-surface ceramic green sheet 212 may be formed to anedge of a lateral surface of the stack body 210 and the remainingportion may be cut due to the punching elastic member 300 formed of arubber material.

FIG. 5F illustrates the case in which the lateral-surface ceramic greensheet 212 is formed to the edge of the lateral surface of the stack body210.

Then, the stack body 210 may be rotated and, thus, the second sidemargin portion may be formed on a second lateral surface of the stackbody 210.

Then, a stack body with first and second side margin portions beingformed on opposite lateral surfaces of the stack body 210 may beplasticized and sintered to form a ceramic body including a dielectriclayer and first and second internal electrodes.

According to an exemplary embodiment of the present disclosure,adhesives are coated on the top of the lateral-surface ceramic greensheet 212 and, thus, the lateral-surface ceramic green sheet 212 may betransferred to a lateral surface of the stack body 210 at lowtemperature and low pressure, differently from the conventional case.

Accordingly, damage generated in the stack body 210 may be minimizedand, thus, the electrical characteristics of a multilayer ceramiccapacitor may be prevented from being degraded after being sintered,thereby enhancing reliability.

The lateral-surface ceramic green sheet 212 with adhesives coatedthereon may be transferred to a lateral surface of the stack body 210and may be pressed during a sintering procedure, thereby enhancingadhesive force between the stack body and the lateral-surface ceramicgreen sheet.

Accordingly, generation of a void at an interface between the ceramicbody and the side margin portion after a sintering procedure may berepressed and a ratio of the edges of the internal electrode, on whichthe oxide region 140 is disposed, to an overall area of the plurality ofinternal electrodes 121 and 122 exposed through the first and secondsurfaces of the ceramic body according to an exemplary embodiment of thepresent disclosure may be adjusted to be less than 10%, therebyrepressing generation of the oxide region.

Then, external electrodes may be respectively formed on a third lateralsurface of the ceramic body, through which the first internal electrodeis exposed, and a fourth lateral surface of the ceramic body, throughwhich the second internal electrode is exposed.

According to another exemplary embodiment of the present disclosure, alateral-surface ceramic green sheet is thin and has a small thicknessdeviation to ensure a large capacity formation portion.

In detail, an average thickness of the first and second side marginportions 112 and 113 may be between 2 μm and 10 μm after the first andsecond side margin portions 112 and 113 are sintered and a large size ofthe capacity formation portion may be ensured due to a small thicknessdeviation for each position.

Accordingly, it may be possible to embody a high-capacity multilayerceramic capacitor.

In addition, a description of the same parts as in the aforementionedexemplary embodiment of the present disclosure is omitted here to avoidrepetition of the description.

Although the present disclosure is described below in detail throughExperimental Example, this is for aiding in understanding of the presentdisclosure and the scope of the present disclosure is not limited byExperimental Example.

Experimental Example

According to an exemplary embodiment of the present disclosure,Comparative Example in which a conventional side margin portion isformed without repressing generation of an oxide region on the edges ofthe internal electrode and Inventive Example in which a side marginportion is formed to repress generation of an oxide region on the edgesof the internal electrode like in the present disclosure are prepared.

In addition, a ceramic green sheet stack body is formed in such a mannera side margin portion is formed by attaching a lateral-surface ceramicgreen sheet to an exposed portion of an electrode of a green chipwithout margin because an internal electrode is exposed in a widthdirection.

Predetermined temperature and pressure are applied under a conditionwith minimized modification of a chip and lateral-surface ceramic greensheets are attached to opposite surfaces of a ceramic green sheet stackbody to manufacture multilayer ceramic capacitor green chip with 0603size (width×length×height: 0.6 mm×0.3 mm×0.3 mm).

The completely manufactured multilayer ceramic capacitor test piece isplasticized at 400□ or less and in a nitrogen atmosphere, is sintered atsintering temperature of 1200□ or less and a condition of hydrogen ionconcentration of H2 of 0.5% or less and, then, the electricalcharacteristics such as outer failure, dielectric resistance, waterproofcharacteristics are synthetically checked.

FIG. 6 is a graph showing comparison of a breakdown voltage (BDV)according to Inventive Example and Comparative Example.

Referring to FIG. 6, Inventive Example corresponds to the case in whicha ratio of an end portion of an internal electrode, on which an oxideregion is disposed, to an overall area of the internal electrode exposedthrough the first and second surfaces of the ceramic body is adjusted tobe less than 10% in a cross-section cut along a width-thickness plane ofthe ceramic body to manufacture a multilayer ceramic capacitor,Comparative Example 1 corresponds to a conventional multilayer ceramiccapacitor configured in such a manner that a ratio to the edges of theinternal electrode, on which the oxide region is disposed, to an overallarea of the internal electrode exposed through the first and secondsurfaces of the ceramic body is equal to or greater than 80% in across-section cut along a width-thickness plane of the ceramic body, andComparative Example 2 corresponds to the case in which a ratio of voidsformed on edges of the internal electrode to an overall area of theinternal electrode exposed through the first and second surfaces of theceramic body is equal to or greater than 80% in a cross-section cutalong a width-thickness plane of the ceramic body.

It may be seen that, in the case of the Inventive Example, a breakdownvoltage (BDV) is enhanced, as compared to Comparative Examples 1 and 2corresponding to the conventional multilayer ceramic capacitor.

In the case of Comparative Example 1, a breakdown voltage (BDV) isincreased, as compared to Comparative Example 2 but is lower than inInventive Example. Thus, according to an exemplary embodiment of thepresent disclosure, a ratio of the edges of the internal electrode, onwhich the oxide region is disposed, to an overall area of the internalelectrode exposed through the first and second surfaces of the ceramicbody may be adjusted to be less than 10%.

As set forth above, according to an exemplary embodiment in the presentdisclosure, an oxide region may be adjusted to be disposed on an endportion of an internal electrode, forming less than 10% of an externalarea of the internal electrode exposed through a surface of a ceramicbody, on which first and second side margin portions are exposed and,thus, a ratio of a void and an oxide region are reduced to enhance abreakdown voltage (BDV) and to enhance reliability.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentdisclosure as defined by the appended claims.

What is claimed is:
 1. A multilayer ceramic capacitor comprising: aceramic body including a dielectric layer and having first and secondsurfaces opposing each other in a width direction of the ceramic body,third and fourth surfaces connecting the first and second surfaces in alength direction of the ceramic body, and fifth and sixth surfacesconnected to the first to fourth surfaces and opposing each other in athickness direction of the ceramic body; internal electrodes disposedinside the ceramic body, exposed through the first and second surfaces,and having one end portion exposed through the third or fourth surface;and first and second side margin portions disposed on edges of theinternal electrodes, exposed through the first and second surfaces,wherein in a cross-section cut along a width-thickness plane of theceramic body, an area of an oxide region disposed on the edges of theinternal electrodes is less than 10% of an overall area of the internalelectrodes exposed through the first and second surfaces, and whereinthe dielectric layer has thickness equal to or less than 0.4 μm.
 2. Themultilayer ceramic capacitor of claim 1, wherein the first side marginportion includes a first region adjacent to an external surface of thefirst side margin portion and a second region adjacent to the internalelectrodes exposed through the first surface, and content of magnesium(Mg) included in the second region of the first side margin portion isgreater than content of magnesium (Mg) included in the first region ofthe first side margin portion, and the second side margin portionincludes a first region adjacent to an external surface of the secondside margin portion and a second region adjacent to the internalelectrodes exposed through the second surface, and content of magnesium(Mg) included in the second region of the second side margin portion isgreater than content of magnesium (Mg) included in the first region ofthe second side margin portion.
 3. The multilayer ceramic capacitor ofclaim 2, wherein a mole ratio of the content of magnesium (Mg) of thesecond region of the first side margin portion to content of titanium(Ti) included in the first side margin portion is 10% to 30%, and a moleratio of the content of magnesium (Mg) of the second region of thesecond side margin portion to content of titanium (Ti) included in thesecond side margin portion is 10% to 30%.
 4. The multilayer ceramiccapacitor of claim 1, wherein a ratio of a thickness of a region of thefirst or second side margin portion, contacting an end of an internalelectrode disposed as the outermost portion, to a thickness of a regionof the first or second side margin portion, contacting an end of aninternal electrode disposed at a central portion among the internalelectrodes, is between 0.9 and 1.0.
 5. The multilayer ceramic capacitorof claim 1, wherein a ratio of a thickness of a region of the first orsecond side margin portion, contacting an edge of the ceramic body, to athickness of a region of the first or second side margin portion,contacting an end of an internal electrode disposed at a central portionamong the internal electrodes, is between 0.9 and 1.0.
 6. The multilayerceramic capacitor of claim 1, wherein the internal electrode has athickness equal to or less than 0.4 μm.
 7. The multilayer ceramiccapacitor of claim 1, wherein the first and second side margin portionshave an average thickness between 2 μm and 10 μm.
 8. A method ofmanufacturing a multilayer ceramic capacitor, the method comprising:preparing a first ceramic green sheet on which a plurality of firstinternal electrode patterns are formed at a predetermined interval and asecond ceramic green sheet on which a plurality of second internalelectrode patterns are formed at a predetermined interval; forming aceramic green sheet stack body by stacking the first and second ceramicgreen sheets in such a manner that the first and second internalelectrode patterns overlap with each other; cutting the ceramic greensheet stack body to have a lateral surface through which edges of thefirst and second internal electrode patterns are exposed in a widthdirection; forming first and second side margin portions on the lateralsurface through which the edges of the first and second internalelectrode patterns are exposed; and preparing a ceramic body including adielectric layer and internal electrodes by sintering the cut ceramicgreen sheet stack body portion, wherein in a cross-section cut along awidth-thickness plane of the ceramic body, an area of an oxide regiondisposed on edges of the internal electrodes is less than 10% of anoverall area of the internal electrodes exposed through a lateralsurface of the ceramic body, a thickness direction of the ceramic bodyis a direction along which the internal electrodes are stacked, and awidth direction of the ceramic body is a direction along which theinternal electrodes are exposed through the lateral surface, and whereinthe first and second ceramic green sheets have a thickness equal to orless than 0.6 μm
 9. The method of claim 8, wherein the first side marginportion includes a first region adjacent to an external surface of thefirst side margin portion and a second region adjacent to the internalelectrodes, and content of magnesium (Mg) included in the second regionof the first side margin portion is greater than content of magnesium(Mg) included in the first region of the first side margin portion, andthe second side margin portion includes a first region adjacent to anexternal surface of the second side margin portion and a second regionadjacent to the internal electrodes, and content of magnesium (Mg)included in the second region of the second side margin portion isgreater than content of magnesium (Mg) included in the first region ofthe second side margin portion.
 10. The method of claim 9, wherein amole ratio of the content of magnesium (Mg) of the second region of thefirst side margin portion to content of titanium (Ti) included in thefirst side margin portion is 10% to 30%, and a mole ratio of the contentof magnesium (Mg) of the second region of the second side margin portionto content of titanium (Ti) included in the second side margin portionis 10% to 30%.
 11. The method of claim 8, wherein the first and secondinternal electrode patterns have a thickness equal to or less than 0.5μm.
 12. The method of claim 8, wherein a ratio of a thickness of aregion of the first or second side margin portion, contacting an end ofan internal electrode disposed as the outermost portion, to a thicknessof a region of the first or second side margin portion, contacting anend of an internal electrode disposed at a central portion of theinternal electrodes, is between 0.9 and 1.0.
 13. The method of claim 8,wherein a ratio of a thickness of a region of the first or second sidemargin portion, contacting an edge of the ceramic body, to a thicknessof a region of the first or second side margin portion, contacting anend of an internal electrode disposed at a central portion of theinternal electrodes, is between 0.9 and 1.0.
 14. The method of claim 8,wherein the first and second side margin portions have an averagethickness between 2 μm and 10 μm.